JPH0533744B2 - - Google Patents

Info

Publication number
JPH0533744B2
JPH0533744B2 JP61201036A JP20103686A JPH0533744B2 JP H0533744 B2 JPH0533744 B2 JP H0533744B2 JP 61201036 A JP61201036 A JP 61201036A JP 20103686 A JP20103686 A JP 20103686A JP H0533744 B2 JPH0533744 B2 JP H0533744B2
Authority
JP
Japan
Prior art keywords
sensor chip
glass epoxy
epoxy substrate
wire bonding
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61201036A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6355451A (ja
Inventor
Kimitoku Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61201036A priority Critical patent/JPS6355451A/ja
Publication of JPS6355451A publication Critical patent/JPS6355451A/ja
Publication of JPH0533744B2 publication Critical patent/JPH0533744B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
JP61201036A 1986-08-26 1986-08-26 バイオセンサ Granted JPS6355451A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61201036A JPS6355451A (ja) 1986-08-26 1986-08-26 バイオセンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61201036A JPS6355451A (ja) 1986-08-26 1986-08-26 バイオセンサ

Publications (2)

Publication Number Publication Date
JPS6355451A JPS6355451A (ja) 1988-03-09
JPH0533744B2 true JPH0533744B2 (en]) 1993-05-20

Family

ID=16434370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61201036A Granted JPS6355451A (ja) 1986-08-26 1986-08-26 バイオセンサ

Country Status (1)

Country Link
JP (1) JPS6355451A (en])

Also Published As

Publication number Publication date
JPS6355451A (ja) 1988-03-09

Similar Documents

Publication Publication Date Title
DK0395137T3 (da) Sensor med antigen kemisk bundet til en halvlederindretning
EP0258951A3 (en) Process for manufacturing a refet or a chemfet, and the manufactured refet or chemfet
ES2025689T3 (es) Composicion de diorganopolisiloxano endurecible en elastomero autoadherente.
ATE95543T1 (de) Klebeverfahren fuer wasserdampfundurchlaessige substrate.
CA1271398C (en) DIAGNOSTIC KIT
ZA897740B (en) Adhesive and sealing substance based on rubber and process for the connection or bonding of components or structural parts
EP0779503B1 (en) Infrared sensor
JPH0533744B2 (en])
EP0300641B1 (en) Sensor arrangements
ATE19645T1 (de) Verfahren zum dauerhaften spannungsausgleichenden verbinden von konstruktionsteilen mit unterschiedlichen ausdehnungskoeffizienten.
JPH0431585Y2 (en])
Sakai et al. A backside contact ISFET with a silicon-insulator-silicon structure
EP0262968A3 (en) Method of forming weathertight seal
JPH0432645Y2 (en])
JPH0645248Y2 (ja) ガス検知器
JP2503640B2 (ja) リ―ドフレ―ム用のダイパツド
JPS6461660A (en) Semiconductor biosensor
JPH0585862B2 (en])
JPH02223855A (ja) イオンセンサ
JPH0432646Y2 (en])
JPS55116773A (en) Bonding method
JPS5487183A (en) Package for semiconductor device
JPH0596894A (ja) Icカード
JPS5839039A (ja) 樹脂封止形半導体装置
JPS61236638A (ja) 腕時計用カバ−ガラスの接着固定方法